verinso@verinso.gr

(+30) 211 1877200

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verinso@verinso.gr

(+30) 211 1877200

Mon - Fri: 08:30 - 16:30

verinso@verinso.gr

(+30) 211 1877200

Mon - Fri: 08:30 - 16:30

Category:

Trim Cooler

Vertiv™ CoolLoop Trim Cooler

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Additional Information

Manufacturer

Vertiv

Category

Trim Cooler

Cooling Capacity (CH)

501-1000kW, 1001-3000kW

Cooling Type

Air, Hybrid, Coolant

Refrigerant

R1234ze

The Vertiv™ CoolLoop Trim Cooler is an advanced next-generation heat rejection solution designed for high-density Data Centers, Artificial Intelligence (AI) applications and modern liquid cooling architectures. With cooling capacity from 850 to 3000 kW, the series leverages Free Cooling technology and allows cooling systems to operate with return water temperatures up to 50°C, supporting both traditional IT environments and highly demanding AI workloads. Its completely dry design eliminates the need for water and its treatment, while the use of very low GWP R1234ze refrigerant ensures compliance with modern environmental requirements. Thanks to its modular and compact architecture, the CoolLoop Trim Cooler offers excellent scalability and flexibility for future growth of Data Center infrastructures.

Key advantages:

  • AI & High Density Ready, suitable for modern AI, HPC and Liquid Cooling infrastructures.

  • Support for Air-Cooled, Hybrid and Liquid-Cooled architectures.

  • Free Cooling optimization, with the potential to save energy up to 70% on an annual basis.

  • Use of low GWP refrigerant R1234ze, reducing the environmental footprint

  • Zero Water Waste Design, no need for water supply or treatment.

  • Completely dry solution (Dry Cooler Technology) with simplified operation and maintenance.

  • Support for return water temperatures up to 50°C.

  • High scalability with cooling capacity up to 2.6 MW (or up to 3 MW in air-cooled configurations).

  • Compact design with increased cooling density and reduced installation footprint.

  • Ideal for Direct-to-Chip Cooling, Rear Door Cooling, CDU Solutions and modern AI infrastructure applications.